C1812C332J2GAC7800 Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 3300pF; Working Voltage (Vdc)[max]: 200V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126" Container: Tape & Reel, 7" Reel, Plastic Tape; Features: Unmarked
C1812C392J2GAC7800 Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 200V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126" Container: Tape & Reel, 7" Reel, Plastic Tape; Features: Unmarked
C1812C334J5RAL Ceramic Chip Capacitors / Tin Lead L Termination; Capacitance [nom]: 0.33uF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126" Container: Bulk; Features: Unmarked
C1812C334M5RAC Ceramic Chip Capacitors / Standard X7R; Capacitance [nom]: 0.33uF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-20%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126" Container: Bulk; Features: Unmarked
C1812C332K1GAC Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 3300pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126" Container: Bulk; Features: Unmarked
C1812C394K5RAL Ceramic Chip Capacitors / Tin Lead L Termination; Capacitance [nom]: 0.39uF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126" Container: Bulk; Features: Unmarked
C1812C334J1RAC Ceramic Chip Capacitors / Standard X7R; Capacitance [nom]: 0.33uF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126" Container: Bulk; Features: Unmarked
C1812C392F1GAC Ceramic Chip Capacitors / Standard C0G; Capacitance [nom]: 3900pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-1%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126" Container: Bulk; Features: Unmarked
C1812C394K5RAC7800 Ceramic Chip Capacitors / Standard X7R; Capacitance [nom]: 0.39uF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1812; Termination: Tin Plated Nickel Barrier; Body Dimensions: 0.177" x 0.126" Container: Tape & Reel, 7" Reel, Plastic Tape; Features: Unmarked
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