LS-BGA676C-22 Land Sockets (Chip Carrier)(LS); Top Package Code: BGA676C; Bottom Package Code: Top Pitch (mm): 1; Bottom Pitch (mm): 1; Top Pin Count: 676; Bottom Pin Count: 676; Top Array Size: 26 x 26; Bottom Array Size: 26 x 26; Top Interface: Surface Mount Land Pattern; Bottom Interface: Female Receptacle; Compatible Part 1: SF-BGA676C-B-11; Part Description: BGA Land Socket;
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