Technical Data:

Insulator Material: High Temperature

Thermoplastic,LCP,UL 94V-0

Contact: stamped and formed,BeCu

Plating: Au or Sn over Nickel

Current Rating: 3.1A @ 30℃ Temperature Rise

Contact resistance: 20 milliohms Max.

Insulator resistance: 500 Megohms min.

Dielectric withstanding: AC 500V for 1 Minute.

Operating Temperature: -55℃ to +125℃

Max. processing Temp: 230℃ for 30-60 seconds.

260℃ for 10 seconds.

Mates with: 1.57mm Card

Technical data:

Insulator Material: High Temperature      Thermoplastic,LCP,UL 94V-0.

Contact Material: Stamped and formed,Phosphor Bronze

Clip Material: Stamped and formed,Brass

Contact Plating: Au or PdNi+Au over Nickel

Clip Plating: Matt Sn over Nickel

Air-and creepage distance: 0.4mm

Insulator resistance: 10000 Megohms min.

Dielectric withstanding: AC 500V for 1 Minute.

Operating Temperature: -55℃ to +125℃.

Max. processing Temp: 230℃ for 30-60 seconds.    260℃ for 10 seconds

Technical data:

Insulator Material: High Temperature      Thermoplastic,LCP,UL 94V-0.

Contact Material: Stamped and formed,Phosphor Bronze

Clip Material: Stamped and formed,Brass

Contact Plating: Au or PdNi+Au over Nickel

Clip Plating: Matt Sn over Nickel

Air-and creepage distance: 0.4mm

Insulator resistance: 10000 Megohms min.

Dielectric withstanding: AC 500V for 1 Minute.

Operating Temperature: -55℃ to +125℃.

Max. processing Temp: 230℃ for 30-60 seconds.    260℃ for 10 seconds.